Archive for June, 2008
Monthly Archive
Friday, June 6th, 2008
Stack ‘Em Up: IBM Demos New Way to Cool Chips - Hardware - IT Channel News by CRN and VARBusiness
IBM has delivered the first working prototype of its water-cooled 3D chips. They announced the discovery about a year ago but this is the first prototype they ‘ve shown the public. The processors operate with multiple layers of circuits and components stacked on top of each other, allowing for a ‘3D […]